bonded wire

• First we measured s - parameter of the device and package shell . the package shell and bonding wire are expressed with equipment circuit composed of the resistance , capacitance and inductance then acquired the value of component by optimizing using microwave emulation software ( microwave office )
  首先，测量出管壳封装器件和管壳的s参数，把管壳和键合线均表示为由电容、电感、电阻组成的等效电路，再用微波仿真软件( microwaveoffice )优化出元件数值。